To adopt an alternative means for electrical bonding of swimming pools than that provided in the 2005 edition of the National Electrical Code.

DEPARTMENT OF COMMUNITY AFFAIRS
Division of Housing and Community Development

RULE NO: RULE TITLE
9B-3.0477: Electrical Bonding of Pools.
PURPOSE AND EFFECT: To adopt an alternative means for electrical bonding of swimming pools than that provided in the 2005 edition of the National Electrical Code.
SUMMARY: The rule allows electrical bonding of swimming pools constructed in Florida in a manner consistent with the Draft edition of the 2008 National Electrical Code. Specifically, a single, 8AWG wire may be utilized in lieu of the copper bonding grid currently required under identified conditions and circumstances. The method adequately provides for safety and costs significantly less than the copper bonding grid.
SUMMARY OF STATEMENT OF ESTIMATED REGULATORY COSTS: No Statement of Estimated Regulatory Cost was prepared.
Any person who wishes to provide information regarding a statement of estimated regulatory costs, or provide a proposal for a lower cost regulatory alternative must do so in writing within 21 days of this notice.
SPECIFIC AUTHORITY: s. 1, Chapter 2007-187, Laws of Florida.
LAW IMPLEMENTED: 553.72, 553.73(2), 553.73(3), 553.73(7), 553.73(9) FS., s. 1, Chapter 2007-187, Laws of Florida.
A HEARING WILL BE HELD AT THE DATE, TIME AND PLACE SHOWN BELOW:
DATE AND TIME: August 21, 2007, 1:00 p.m., or as soon thereafter as the matter comes before the Commission pursuant to its agenda
PLACE: Embassy Suites Tampa – USF, 3705 Spectrum Boulevard, Tampa, Florida 33612-0412
Pursuant to the provisions of the Americans with Disabilities Act, any person requiring special accommodations to participate in this workshop/meeting is asked to advise the agency at least 7 days before the workshop/meeting by contacting: Mo Madani, Planning Manager, Department of Community Affairs, 2555 Shumard Oak Boulevard, Sadowski Building, Tallahassee, Florida 32399-2100, [phone]. If you are hearing or speech impaired, please contact the agency using the Florida Relay Service, 1(800)955-8771 (TDD) or 1(800)955-8770 (Voice).
THE PERSON TO BE CONTACTED REGARDING THE PROPOSED RULE IS: Mo Madani, Planning Manager, Department of Community Affairs, 2555 Shumard Oak Boulevard, Sadowski Building, Tallahassee, Florida 32399-2100, [phone]

THE FULL TEXT OF THE PROPOSED RULE IS:

9B-3.0477 Electrical Bonding of Pools.

National Fire Protection Association [NFPA] 70-05: National Electric Code, Article 680 (Swimming Pools, Fountains, and Similar Installation), Section 680.26, Equipotential Bonding, as adopted within Chapter 27 of the Florida Building Code, Building Volume; and to NFPA 70A-05: National Electric Code, Article 680 (Swimming Pools, Fountains, and Similar Installation), Section 680.26, Equipotential Bonding, adopted within Chapter 33 of the Florida Building Code, Residential Volume, define bonding requirements for swimming pools constructed in the State. In response to legislative direction, the Florida Building Commission has adapted the draft 2008 National Electrical Code requirements for immediate use as set forth below. As an alternative to the requirements in the Building Code as adopted in Rule 9B-3.047, F.A.C., the following shall be permissible:

(1) Performance. The equipotential bonding required by this section shall be installed to reduce voltage gradients in the pool area.

(2) Bonded Parts. The parts specified in paragraphs (a) through (g) hereof shall be bonded together using solid copper conductors, insulated covered, or bare, not smaller than 8 AWG or with rigid metal conduit of brass or other identified corrosion-resistant metal. Connections to bonded parts shall be made in accordance with Section 250.8 of the National Electrical Code as adopted within the Florida Building Code. An 8 AWG or larger solid copper bonding conductor provided to reduce voltage gradients in the pool area shall not be required to be extended or attached to any remote panelboard, to service equipment, or electrodes.

(a) Conductive Pool Shells. Bonding to conductive pool shells shall be provided as specified in subparagraphs 1. or 2. hereof. Poured concrete, pneumatically applied or sprayed concrete, and concrete block with painted or plastered coating shall all be considered conductive materials due to water permeability and porosity. Vinyl liners and fiberglass composite shells shall be considered to be non-conductive materials.

1. Structural Reinforcing Steel. Unencapsulated structural reinforcing steel shall be bonded together by steel tie wires or the equivalent. Where structural reinforcing steel is encapsulated in a nonconductive compound, a copper conductor grid shall be installed in accordance with subparagraph 2.

2. Copper Conductor Grid. A copper conductor grid shall be provided and shall comply with the following conditions:

a. Be constructed of minimum 8 AWG bare solid copper conductors bonded to each other at all points of crossing.

b. Conform to the contour of the pool and the pool deck.

c. Be arranged in a 300 mm (12 in.) by 300 mm (12 in.) network of conductors in a uniformly spaced perpendicular grid pattern with a tolerance of 100 mm (4 in.).

d. Be secured within or under the pool no more than 150 mm (6 in.) from the outer contour of the pool shell.

(b) Perimeter Surfaces. The perimeter surface shall extend for 1 m (3 ft) horizontally beyond the inside walls of the pool and shall include unpaved surfaces as well as poured concrete and other types of paving. Bonding to perimeter surfaces shall be provided as specified in subparagraph 1. or 2. hereof, and shall be attached to the pool reinforcing steel or copper conductor grid at a minimum of four (4) points uniformly spaced around the perimeter of the pool. For non-conductive pool shells, bonding at four points shall not be required.

1. Structural Reinforcing Steel. Structural reinforcing steel shall be bonded in accordance with subparagraph (2)(a)1.

2. Alternate Means. Where structural reinforcing steel is not available or is encapsulated in a nonconductive compound, copper conductor(s) shall be utilized where the following conditions are met:

a. At least one minimum 8 AWG bare solid copper conductor shall be provided.

b. The conductor(s) shall follow the contour of the perimeter surface.

c. Only listed splices shall be permitted.

d. The required conductor shall be 450 to 600 mm (18 to 24 in.) from the inside walls of the pool.

e. The required conductor shall be secured within or under the perimeter surface 100 to 150 mm (4 to 6 in.) below the subgrade.

(c) Metallic Components. All metallic parts of the pool structure, including reinforcing metal not addressed in subparagraph (2)(a)1., shall be bonded. Where reinforcing steel is encapsulated with a nonconductive compound, the reinforcing steel shall not be required to be bonded.

(d) Underwater Lighting. All metal forming shells and mounting brackets of no-niche luminaires shall be bonded except that listed low-voltage lighting systems with nonmetallic forming shells shall not require bonding.

(e) Metal Fittings. All metal fittings within or attached to the pool structure shall be bonded. Isolated parts that are not over 100 mm (4 in.) in any dimension and do not penetrate into the pool structure more than 25 mm (1 in.) shall not require bonding.

(f) Electrical Equipment. Metal parts of electrical equipment associated with the pool water circulating system, including pump motors and metal parts of equipment associated with pool covers, including electric motors, shall be bonded except that metal parts of listed equipment incorporating an approved system of double insulation shall not be bonded.

1. Double-Insulated Water Pump Motors. Where a double-insulated water-pump motor is installed under the provisions of this rule, a solid 8 AWG copper conductor of sufficient length to make a bonding connection to a replacement motor shall be extended from the bonding grid to an accessible point in the vicinity of the pool pump motor. Where there is no connection between the swimming pool bonding grid and the equipment grounding system for the premises, this bonding conductor shall be connected.

2. Pool Water Heaters. For pool water heaters rated at more than 50 amperes and having specific instructions regarding bonding and grounding, only those parts designated to be bonded shall be bonded and only those parts designated to be grounded shall be grounded.

(g) Metal Wiring Methods and Equipment. Metal-sheathed cables and raceways, metal piping, and all fixed metal parts shall be bonded except:

1. Those separated from the pool by a permanent barrier shall not be required to be bonded.

2. Those greater than 1.5 m (5 ft) horizontally of the inside walls of the pool shall not be required to be bonded.

3. Those greater than 3.7 m (12 ft) measured vertically above the maximum water level of the pool, or as measured vertically above any observation stands, towers, or platforms, or any diving structures shall not be required to be bonded.

(3) Pool Water. An intentional bond of a minimum conductive surface area of 5806 square mm (9 square in ) shall be installed in contact with the pool water. This bond shall be permitted to consist of parts that are required to be bonded in (2).

Specific Authority s. 1, Chapter 2007-187, Laws of Florida. Law Implemented 553.72 FS. 553.73(2), 553.73(3), 553.73(7), 553.73(9) FS., s. 1, Chapter 2007-187, Laws of Florida. History–New_______.

NAME OF PERSON ORIGINATING PROPOSED RULE: Mo Madani, Planning Manager, Department of Community Affairs, 2555 Shumard Oak Boulevard, Sadowski Building, Tallahassee, Florida 32399-2100, [phone]
NAME OF SUPERVISOR OR PERSON WHO APPROVED THE PROPOSED RULE: Janice Browning, Director, Division of Housing and Community Development
DATE PROPOSED RULE APPROVED BY AGENCY HEAD: June 27, 2007
DATE NOTICE OF PROPOSED RULE DEVELOPMENT PUBLISHED IN FAW: June 8, 2007